ADLINK has introduced its latest COM Express module, featuring the new Intel Core Ultra Series 3 processors. This compact module is designed for demanding edge AI and embedded systems, combining high-performance AI capabilities with rugged industrial features. It aims to simplify system design while delivering powerful AI processing and graphics performance.

Enhanced AI and Graphics Performance

The new Express-PTL module offers significant leaps in AI processing power. It includes an integrated NPU 5.0 that can deliver up to 50 TOPS of dedicated AI acceleration. This means it can handle complex AI workloads faster and more efficiently than previous models. Alongside the NPU, the module features an Intel Arc GPU with up to 12 X e cores, providing up to 120 TOPS for AI tasks and improved graphics rendering. This combination allows for smoother graphics and faster AI inference, especially useful for applications that demand high visual fidelity and quick data processing.

The module’s advanced hybrid CPU architecture includes 4 high-performance cores, 8 efficiency cores, and 4 low-power cores. This setup improves overall processing efficiency and responsiveness, making it suitable for real-time edge AI applications. It supports up to 128GB of DDR5 memory with In-Band ECC, ensuring low-latency and reliable memory access even in challenging environments.

Designed for Rugged Industrial Environments

One of the key features of this module is its industrial-temperature SKUs, capable of operating in extreme temperatures from -40°C to 85°C. This rugged design makes it ideal for mission-critical applications in harsh environments, such as factory floors, outdoor deployments, or transportation systems. The module also supports features like Time-Sensitive Networking (TSN), TCC, and FuSa/FSEDP compliance, which enhance its reliability and real-time performance in industrial settings.

Additionally, the module includes IBECC memory technology, which helps prevent data corruption and ensures system stability during operation. Its compact size in a COM-HPC Mini form factor makes it suitable for space-constrained applications, enabling integration into a variety of embedded systems without sacrificing performance. The new module is expected to be available in Q2 2026, promising a new level of efficiency and robustness for edge AI deployments.

Overall, ADLINK’s latest module combines cutting-edge AI hardware with rugged design features, making it a versatile choice for complex, mission-critical edge computing tasks. Its balance of power, size, and durability sets a new standard for embedded AI solutions in challenging environments.

Inspired by

• https://ai-techpark.com/adlink-launches-first-com-express-module-with-intel-core-ultra-3/