SK Hynix is exploring new ways to expand memory-chip manufacturing in the United States, but the company says no deal with Intel has been confirmed. The possibilities could reshape how next-generation memory reaches US customers, yet every major piece of the reported talks remains open.
In an official newsroom statement on September 16, 2026, SK Hynix said it has not finalized plans tied to reported discussions with Intel. The report published on the same date described talks about manufacturing memory chips in the United States, with two potential paths under consideration.
Two Routes For A Potential Intel Partnership
The first scenario would see SK Hynix lease part of Intel’s long-planned semiconductor manufacturing facility in Ohio. That approach would give SK Hynix a possible US manufacturing location through an existing Intel project, although no agreement has been reached.
The second scenario would create a joint venture involving SK Hynix, Intel, and major cloud companies. This option would bring the chip maker, Intel, and cloud businesses into one structure, but the report presents it as a possibility rather than a completed plan.
That distinction matters. SK Hynix confirmed that it is exploring options regarding potential semiconductor manufacturing deals with Intel in the United States, while also making clear that no final agreements exist.
The conversations arrive as SK Hynix builds its first US production site in Indiana, giving the company a separate manufacturing push already underway. The Indiana project shows how the company is preparing a US base for high-bandwidth memory, the technology that supports AI products.
Indiana Becomes SK Hynix’s First US HBM Base
On April 3, 2024, SK Hynix announced an estimated $3.87 billion investment in West Lafayette, Indiana. The project will create an advanced packaging fabrication and R&D facility for AI products on an approximately 133-acre site.
The Indiana facility will house an HBM production line and an Advanced Packaging R&D Testbed. SK Hynix planned the site to mass-produce next-generation high-bandwidth memory, with mass production targeted for the second half of 2028.
SK Hynix also plans to supply next-generation HBM to US customers starting in the second half of 2029. That timeline gives the Indiana project a clear role in the company’s US strategy, even as the reported Intel discussions remain unresolved.
At the groundbreaking ceremony on August 27, 2026, SK Hynix marked a major step for the Indiana facility. The event included Indiana Governor Mike Braun, Senator Todd Young, Purdue University President Mitch Daniels, West Lafayette Mayor Erin Easter, and SK Hynix CEO Kwak Noh-Jung.
Kwak Noh-Jung stated that SK Hynix plans to establish the Indiana facility as its first HBM production base in the United States. He also described a goal of supplying “Made in USA” HBM and ensuring a stable supply of next-generation memory to US customers.
Training And Research Move Alongside Production
The Indiana plan reaches beyond factory construction. SK Hynix committed to research collaboration with Purdue University and workforce training programs with Purdue and Ivy Tech Community College, connecting the facility to research and talent development in Indiana.
That combination gives the project three linked parts: production, advanced packaging research, and workforce preparation. The HBM production line will support future output, while the Advanced Packaging R&D Testbed will support work tied to the facility’s technology goals.
The potential Intel arrangements would add another layer to this US expansion. Leasing part of Intel’s Ohio facility could offer one path to manufacturing capacity, while a joint venture with Intel and major cloud companies could create another structure for production and investment.
Neither path has moved into a confirmed agreement. For now, SK Hynix’s clearest US commitment remains the Indiana project, backed by the $3.87 billion investment announced on April 3, 2024 and the groundbreaking held on August 27, 2026.
The next phase will show whether SK Hynix and Intel turn the reported discussions into a formal deal. Whatever happens in Ohio, SK Hynix is moving toward its first US HBM production base in Indiana, with mass production targeted for the second half of 2028 and customer supply planned for the second half of 2029.
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